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Chinese Chinese Products Equipment Series Equipment Series Unpatterned Wafer Defect Inspection Equipment Series Patterned Wafer Defect Inspection Equipment Series Metrology Equipment Series Overlay Metrology Equipment Series 3D Surface Profiling Metrology Equipment Series Dielectric Film Metrology Equipment Series Software series Software Yield Management System DMS/YMS Semiconductor Auto Defect Classification System Skyverse Company Introduction Development History Corporate Culture Certificates of Honor News News Recruitment Social Recruitment Campus Recruitment Contact Investor Relations 3D Surface Profiling Metrology Equipment Series CYPRESS Home > Products > Metrology Equipment Series Product Introduction This series of equipment is primarily designed for nano-level three-dimensional surface profiling, dual/multi-layer thin film thickness measurement, as well as critical dimension and offset measurements on wafer surface. It integrates with automation platforms for intelligent feature identification, process control, wafer handling and transport, and data communication. Its primary applications are in the front-end of the line and advanced packaging. Product Features 1、Achieves 0.1nm precision in three-dimensional surface profiling. 2、Integrates diverse measurement systems to monitor various process. 3、Supports automatic feature search and location, as well as customizable measurement report. 4、Multi-dimensional result evaluation visualizes process issues. 5、Supports batch importing and automatic data reporting to reduce labor costs   Previous Product Overlay Metrology Equipment Series DRAGONBLOOD Next Product Dielectric Film Metrology Equipment Series LATIFILM Products Equipment Series Software series Skyverse Company Introduction Development History Corporate Culture Certificates of Honor News News Recruitment Social Recruitment Campus Recruitment Contact Investor Relations All rights reserved. Infringement will be investigated. 粤ICP备16055877号 WeChat QR Code -->